STMicroelectronics Silicon Photonics: Powers AI Data Centers at Scale

STMicroelectronics Powers AI Infrastructure

STMicroelectronics (NYSE: STM) has entered high-volume production for its state-of-the-art silicon photonics-based PIC100 platform, used by hyperscalers for optical interconnect for data centers and AI clusters. The 800G and 1.6T PIC100 transceivers enable higher bandwidth, lower latency, and greater energy efficiency as AI workloads surge across the globe.

According to The Manila Times, following the announcement of its new silicon photonics technology in February 2025, ST is now delivering on its promise to bring this cutting-edge technology to market at scale. The combination of our technology platform and the superior scale of our 300mm manufacturing lines gives us a unique competitive advantage to support the AI infrastructure super-cycle, said Fabio Gualandris, President, Quality, Manufacturing & Technology at STMicroelectronics. Looking ahead, we are planning and executing on capacity expansions to enable more than quadrupling of production by 2027. This represents a major milestone for STMicroelectronics silicon photonics technology.

The Booming Data Center Optics Market

The data center pluggable optics market continues to expand strongly, reaching $15.5 billion in 2025. According to industry analysts at LightCounting, cited by The Manila Times, the market is expected to grow at a compound annual growth rate (CAGR) of 17% from 2025 through 2030, surpassing $34 billion by the end of the forecast period. This explosive growth is directly tied to the increasing demand for AI infrastructure worldwide.

In addition, co-packaged optics (CPO) will emerge as a rapidly growing segment, contributing more than $9 billion in revenue by 2030. Over the same period, the share of transceivers incorporating silicon photonics modulators is projected to increase from 43% in 2025 to 76% by 2030. This represents a massive shift toward STMicroelectronics silicon photonics technology in data center applications across the industry worldwide.

What Makes PIC100 Special

ST's PIC100 platform provides state-of-the-art optical performance, including best-in-class silicon and silicon nitride waveguide losses (respectively as low as 0.4 and 0.5 dB/cm), advanced modulator and photodiode performance, as well as an innovative edge coupling technology. These specifications make it ideal for the most demanding AI workloads requiring high-speed data transmission. The STMicroelectronics silicon photonics platform is setting new industry standards for performance and efficiency.

In parallel with high-volume PIC100 production, ST is planning to introduce the next step in its silicon photonics technology roadmap: the PIC100 TSV (Through-Silicon Via). This new platform integrates TSV technology to further increase optical connectivity density, module integration, and system-level thermal efficiency. The PIC100 TSV platform is designed to support future generations of Near Packaged Optics (NPO) and co-packaged optics (CPO). This advancement positions STMicroelectronics silicon photonics at the forefront of the industry.

Why This Matters for AI

AI infrastructure is experiencing unprecedented scaling, with cloud-optical interconnect performance becoming a critical bottleneck. As AI models grow larger and more complex, the need for fast data transmission between servers and data centers has never been greater. Traditional copper connections are reaching their limits, making STMicroelectronics silicon photonics the solution of choice for next-generation AI infrastructure.

According to Dr. Vladimir Kozlov, CEO and Chief Analyst at LightCounting, ST's leading silicon photonics platform coupled with its aggressive capacity expansion plan illustrates its capabilities to provide hyperscalers with secure, long-term supply, predictable quality, and manufacturing resilience. The company will discuss its technology roadmap at the upcoming Optical Fiber Communication Conference (OFC 2026) in Los Angeles, where it will present a first PIC100-based demo of a 1.6T-DR8 silicon photonics transceiver. This event will showcase the latest developments in STMicroelectronics silicon photonics technology.

The global push for more efficient AI infrastructure means silicon photonics will play an increasingly important role in how data centers operate. Companies investing in this technology now position themselves to benefit from the AI infrastructure boom. STMicroelectronics silicon photonics solutions provide the foundation for the next generation of AI data centers that can handle increasingly complex workloads while maintaining energy efficiency. The demand for these advanced solutions shows no signs of slowing down as more organizations adopt AI technologies across all sectors and industries.